Investigation of the mechanical behaviour of bonded joints in a cryogenic environment

Schiebahn, Alexander; Seewald, Robert Vitus (Corresponding author); Bayer, M.; Reisgen, Uwe

Porto : Quântica Editora, Lda. (2023)
Contribution to a book, Contribution to a conference proceedings

In: [7th International Conference on Adhesive Bonding, AB2023, 2023-07-13 - 2023-07-14, Porto, Portugal]
Page(s)/Article-Nr.: 163-164

Institutions

• Welding and Joining Institute [417610]